Indium Corporation will feature products from its portfolio of system-in-package material solutions at the Advanced System in Package Technology Conference & Exhibition, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), on Tuesday, June 21 in Sonoma, Calif., U.S.
From water-soluble to no-clean soldering solutions, flip-chip fluxes, and novel mixed alloy technologies, Indium Corporations portfolio of products meets current and evolving challenges encountered in fine-pitch SiP and heterogeneous integration and assembly (HIA) applications.
Indium Corporations proven SiPaste series is specifically designed for fine-feature printing with fine powders ranging from Type 5 to Type 7. They help Avoid the Void, reduce slumps, and demonstrate consistent superior printing performance. Water-soluble SiPaste 3.2HF has been adopted by leading OSATs and has been used in more than 5 billion mobile FEM SiP modules. SiPaste C201HF offers the same superior printing performance with the benefit of having a cleanable chemistry with semi-aqueous-based solutions.
SiPaste 3.2HF formulation offers consistent, repeatable printing performance combined with a long stencil life and sufficient tack strength to handle the challenges of todays miniaturization in SiP design. In addition to consistent printing and reflow requirements, this solder paste offers superb wetting to the various Pb-free metallizations and has exceptional low-voiding performance on fine-pitch components, including BGAs and CSPs.
- Exceptional printing
- Long stencil life
- 좋은 응답-일시 정지
- Wide reflow profile window
- Outstanding slump resistance
- Excellent wetting capability
- Superior fine-pitch soldering ability
- Low-voiding
- Halogen-free
SiPaste C201HF exhibits many of these same benefits, with particular formulation consideration to provide exceptional paste release on sub-80-micron apertures, stable print performance leading to long stencil life, and high tackiness to prevent component shift. This combines with a cleanable chemistry with semi-aqueous-based solutions, allowing for ease of cleaning with minimal cost.
인디엄 코퍼레이션 소개
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재 정제, 제련, 제조 및 공급업체입니다. 제품에는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil 이 포함됩니다. 1934년에 설립된 이 회사는 중국, 독일, 인도, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
About iMAPS SiP
IMAPS has established the Advanced System-in-Package Conference & Exhibition to focus exclusively on innovative SiP technology developments, solutions, and business trends. Advanced SiP 2022 will be a high-end event that combines the IMAPS System-in Package Conference and the 3D ASIP Conference (recognized as the premier conference on 2.5/3D ICs, focused on commercialization and infrastructure). Advanced SiP 2022 will offer cutting-edge presentations from scientists, technologists, and business leaders across the globe in cellular, IoT, automotive, computing, and networking market segments.
