Indium Corporation will feature products from its portfolio of system-in-package material solutions at the Advanced System in Package Technology Conference & Exhibition, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), on Tuesday, June 21 in Sonoma, Calif., U.S.
From water-soluble to no-clean soldering solutions, flip-chip fluxes, and novel mixed alloy technologies, Indium Corporations portfolio of products meets current and evolving challenges encountered in fine-pitch SiP and heterogeneous integration and assembly (HIA) applications.
Indium Corporations proven SiPaste series is specifically designed for fine-feature printing with fine powders ranging from Type 5 to Type 7. They help Avoid the Void, reduce slumps, and demonstrate consistent superior printing performance. Water-soluble SiPaste 3.2HF has been adopted by leading OSATs and has been used in more than 5 billion mobile FEM SiP modules. SiPaste C201HF offers the same superior printing performance with the benefit of having a cleanable chemistry with semi-aqueous-based solutions.
SiPaste 3.2HF formulation offers consistent, repeatable printing performance combined with a long stencil life and sufficient tack strength to handle the challenges of todays miniaturization in SiP design. In addition to consistent printing and reflow requirements, this solder paste offers superb wetting to the various Pb-free metallizations and has exceptional low-voiding performance on fine-pitch components, including BGAs and CSPs.
- Exceptional printing
- Long stencil life
- Good response-to-pause
- Wide reflow profile window
- Outstanding slump resistance
- Excellent wetting capability
- Superior fine-pitch soldering ability
- Low-voiding
- Halogen-free
SiPaste C201HF exhibits many of these same benefits, with particular formulation consideration to provide exceptional paste release on sub-80-micron apertures, stable print performance leading to long stencil life, and high tackiness to prevent component shift. This combines with a cleanable chemistry with semi-aqueous-based solutions, allowing for ease of cleaning with minimal cost.
关于铟泰铟泰公司
铟泰公司 是一家面向全球电子、半导体、薄膜及热管理 市场的顶级材料精炼商、冶炼商、制造商和供应商。 产品包括焊料和助焊剂；硬钎焊 ；热界面材料；溅射靶材 ；铟、镓（Ga） 、锗和锡等金属及无机材料化合物 ；以及NanoFoil 。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度 、马来西亚 、新加坡 、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至Jingya Huang。您还可以关注我们的专家团队“From One Engineer To Another”（#FOETA），访问www.linkedin.com/company/indium-corporation/或关注@IndiumCorp。
About iMAPS SiP
IMAPS has established the Advanced System-in-Package Conference & Exhibition to focus exclusively on innovative SiP technology developments, solutions, and business trends. Advanced SiP 2022 will be a high-end event that combines the IMAPS System-in Package Conference and the 3D ASIP Conference (recognized as the premier conference on 2.5/3D ICs, focused on commercialization and infrastructure). Advanced SiP 2022 will offer cutting-edge presentations from scientists, technologists, and business leaders across the globe in cellular, IoT, automotive, computing, and networking market segments.
