Indium Corporation’s Ed Briggs, Senior Technical Support Engineer, will present at the SMTA Capital Expo & Tech Forum, Sept. 1, in Laurel, Md.
Briggs’ presentation, Transition From Water-Soluble to No-Clean Solder Paste – Just How Easy Is It?, compares the printing and reflow characteristics of water-soluble and no-clean solder pastes to demonstrate the ease of converting to a no-clean soldering process. Briggs will also share a simple strategy to enable the small process changes necessary to make the switch from water-wash to no-clean solder pastes. Peripheral processes such as cleaning and rework will also be covered.
Briggs is an SMTA-certified process engineer. He earned his associate's degree in chemical technology from Mohawk Valley Community College, where he received the Douglas J. Bauer Award for Excellence in Chemistry. In addition, he earned his Six Sigma Green Belt from Dartmouth College. Briggs joined Indium Corporation in 1990 and has held a variety of positions in production and technical support.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, la energía solar, la capa fina y la gestión térmica. Sus productos incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio, germanio y estaño; y NanoFoil®. Fundada en 1934, Indium cuenta con asistencia técnica mundial y fábricas en China, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
Para más información sobre Indium Corporation, visite www.indium.com o envíe un correo electrónico a [email protected]. También puede seguir a nuestros expertos, From One Engineer To Another® (#FOETA), en www.facebook.com/indium o @IndiumCorp.
