Indium Corporation’s Ed Briggs, Senior Technical Support Engineer, will present at the SMTA Capital Expo & Tech Forum, Sept. 1, in Laurel, Md.
Briggs’ presentation, Transition From Water-Soluble to No-Clean Solder Paste – Just How Easy Is It?, compares the printing and reflow characteristics of water-soluble and no-clean solder pastes to demonstrate the ease of converting to a no-clean soldering process. Briggs will also share a simple strategy to enable the small process changes necessary to make the switch from water-wash to no-clean solder pastes. Peripheral processes such as cleaning and rework will also be covered.
Briggs is an SMTA-certified process engineer. He earned his associate's degree in chemical technology from Mohawk Valley Community College, where he received the Douglas J. Bauer Award for Excellence in Chemistry. In addition, he earned his Six Sigma Green Belt from Dartmouth College. Briggs joined Indium Corporation in 1990 and has held a variety of positions in production and technical support.
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持体系，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
