Indium Corporation’s Ed Briggs, Senior Technical Support Engineer, will present at the SMTA Capital Expo & Tech Forum, Sept. 1, in Laurel, Md.
Briggs’ presentation, Transition From Water-Soluble to No-Clean Solder Paste – Just How Easy Is It?, compares the printing and reflow characteristics of water-soluble and no-clean solder pastes to demonstrate the ease of converting to a no-clean soldering process. Briggs will also share a simple strategy to enable the small process changes necessary to make the switch from water-wash to no-clean solder pastes. Peripheral processes such as cleaning and rework will also be covered.
Briggs is an SMTA-certified process engineer. He earned his associate's degree in chemical technology from Mohawk Valley Community College, where he received the Douglas J. Bauer Award for Excellence in Chemistry. In addition, he earned his Six Sigma Green Belt from Dartmouth College. Briggs joined Indium Corporation in 1990 and has held a variety of positions in production and technical support.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、太陽電池、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがあります。1934年に設立されたインジウムは、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を有しています。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
