Indium Corporations Alloy Group R&D Manager Dr. HongWen Zhang will deliver a presentation on the companys award-winning Durafuse mixed-alloy technology as part of its popular InSIDER Series of webinars. The presentation, titled Solder Challenges and Product Development with Durafuse Technology, will be given on Wednesday, April 27 at 8 a.m. San Francisco/11 a.m. New York/4 p.m. London/5 p.m. Germany.
Dr. Zhangs presentation will focus on the shortcomings of traditional solder materials and examine the ability of Indium Corporations Durafuse technology to provide a solution to these challenges. He will highlight the benefits of Durafuse LT, a patented, innovative, low-temperature, mixed-alloy technology that offers enhanced reliability with drop shock performance two orders of magnitude better than Bi-containing solders. He will also discuss Durafuse HT, a new patent-pending product designed as a drop-in solution to replace and outperform the traditional high-lead solders in die-attach and clip-bond applications. Click here to register.
Dr. Zhang is manager of the alloy group in Indium Corporations R&D department. His focus is on the development of Pb-free solder materials and the associated technologies for high-temperature and high-reliability applications. He was instrumental in inventing the mixed-alloy solder technique to combine the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding surface, and control the joints morphology, thus improving reliability.
Dr. Zhang has a bachelors degree in metallurgical physical chemistry from Central South University of China, a masters degree in materials and engineering from the Institute of Metal Research, Chinese Academy of Science, and a masters degree in mechanical engineering and a Ph.D. in material science and engineering from the Michigan Technological University. He has a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, and is a certified IPC Specialist for IPC-A-600 and IPC-A-610 as well as a certified SMT Process Engineer. He has extensive experience in various aluminum (Al) alloys and fiber/particle reinforced Al-based composite materials, and Al-rich and ZrHf-based amorphous alloys. He has co-authored two book chapters on high-temperature lead-free bonding materials, has had a number of patents filed, and has been published in approximately 20 journals in the fields of metallurgy, materials science and engineering, physics, electronics materials, and mechanics.
Acerca de Indium Corporation
Indium Corporation es un importante refinador, fundidor, fabricante y proveedor de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Sus productos incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio, germanio y estaño; y NanoFoil. Fundada en 1934, la empresa cuenta con asistencia técnica mundial y fábricas en China, Alemania, India, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
Para más información sobre Indium Corporation, visite www.indium.com o envíe un correo electrónico a Jingya Huang. También puede seguir a nuestros expertos, From One Engineer To Another (#FOETA), en www.linkedin.com/company/indium-corporation/ o @IndiumCorp.
Acerca de la serie InSIDER
El programa gratuito de seminarios web de Indium Corporations diseñado para el desarrollo profesional, lanzado en abril de 2020, ha incluido más de 30 temas presentados a miles de profesionales del sector a través de sus sesiones en directo y su archivo de grabaciones. Haga clic aquí para obtener más información.
