Indium Corporations Alloy Group R&D Manager Dr. HongWen Zhang will deliver a presentation on the companys award-winning Durafuse mixed-alloy technology as part of its popular InSIDER Series of webinars. The presentation, titled Solder Challenges and Product Development with Durafuse Technology, will be given on Wednesday, April 27 at 8 a.m. San Francisco/11 a.m. New York/4 p.m. London/5 p.m. Germany.
Dr. Zhangs presentation will focus on the shortcomings of traditional solder materials and examine the ability of Indium Corporations Durafuse technology to provide a solution to these challenges. He will highlight the benefits of Durafuse LT, a patented, innovative, low-temperature, mixed-alloy technology that offers enhanced reliability with drop shock performance two orders of magnitude better than Bi-containing solders. He will also discuss Durafuse HT, a new patent-pending product designed as a drop-in solution to replace and outperform the traditional high-lead solders in die-attach and clip-bond applications. Click here to register.
Dr. Zhang is manager of the alloy group in Indium Corporations R&D department. His focus is on the development of Pb-free solder materials and the associated technologies for high-temperature and high-reliability applications. He was instrumental in inventing the mixed-alloy solder technique to combine the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding surface, and control the joints morphology, thus improving reliability.
Dr. Zhang has a bachelors degree in metallurgical physical chemistry from Central South University of China, a masters degree in materials and engineering from the Institute of Metal Research, Chinese Academy of Science, and a masters degree in mechanical engineering and a Ph.D. in material science and engineering from the Michigan Technological University. He has a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, and is a certified IPC Specialist for IPC-A-600 and IPC-A-610 as well as a certified SMT Process Engineer. He has extensive experience in various aluminum (Al) alloys and fiber/particle reinforced Al-based composite materials, and Al-rich and ZrHf-based amorphous alloys. He has co-authored two book chapters on high-temperature lead-free bonding materials, has had a number of patents filed, and has been published in approximately 20 journals in the fields of metallurgy, materials science and engineering, physics, electronics materials, and mechanics.
인디엄 코퍼레이션 소개
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재 정제, 제련, 제조 및 공급업체입니다. 제품에는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil 이 포함됩니다. 1934년에 설립된 이 회사는 중국, 독일, 인도, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인디움 코퍼레이션에 대한 자세한 정보는 www.indium.com 또는 징야 황에게 이메일을 보내주세요. 또한 From One Engineer To Another (#FOETA)의 전문가를 www.linkedin.com/company/indium-corporation/ 또는 @IndiumCorp에서 팔로우할 수도 있습니다.
About InSIDER Series
Indium Corporations free webinar program designed for professional development, launched in April 2020, has included more than 30 topics presented to thousands of industry professionals via its live sessions and recordings archive. Click here to learn more.
