Indium Corporations Alloy Group R&D Manager Dr. HongWen Zhang will deliver a presentation on the companys award-winning Durafuse mixed-alloy technology as part of its popular InSIDER Series of webinars. The presentation, titled Solder Challenges and Product Development with Durafuse Technology, will be given on Wednesday, April 27 at 8 a.m. San Francisco/11 a.m. New York/4 p.m. London/5 p.m. Germany.
Dr. Zhangs presentation will focus on the shortcomings of traditional solder materials and examine the ability of Indium Corporations Durafuse technology to provide a solution to these challenges. He will highlight the benefits of Durafuse LT, a patented, innovative, low-temperature, mixed-alloy technology that offers enhanced reliability with drop shock performance two orders of magnitude better than Bi-containing solders. He will also discuss Durafuse HT, a new patent-pending product designed as a drop-in solution to replace and outperform the traditional high-lead solders in die-attach and clip-bond applications. Click here to register.
Dr. Zhang is manager of the alloy group in Indium Corporations R&D department. His focus is on the development of Pb-free solder materials and the associated technologies for high-temperature and high-reliability applications. He was instrumental in inventing the mixed-alloy solder technique to combine the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding surface, and control the joints morphology, thus improving reliability.
Dr. Zhang has a bachelors degree in metallurgical physical chemistry from Central South University of China, a masters degree in materials and engineering from the Institute of Metal Research, Chinese Academy of Science, and a masters degree in mechanical engineering and a Ph.D. in material science and engineering from the Michigan Technological University. He has a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, and is a certified IPC Specialist for IPC-A-600 and IPC-A-610 as well as a certified SMT Process Engineer. He has extensive experience in various aluminum (Al) alloys and fiber/particle reinforced Al-based composite materials, and Al-rich and ZrHf-based amorphous alloys. He has co-authored two book chapters on high-temperature lead-free bonding materials, has had a number of patents filed, and has been published in approximately 20 journals in the fields of metallurgy, materials science and engineering, physics, electronics materials, and mechanics.
インジウム・コーポレーションについて
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理市場向けの一流の材料精製、製錬、製造、サプライヤーである。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil などがある。1934年に設立され、グローバルな技術サポートと中国、ドイツ、インド、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
インジウム・コーポレーションについての詳細は、www.indium.comをご覧いただくか、Jingya HuangまでEメールにてお問い合わせください。また、当社の専門家であるFrom One Engineer To Another (#FOETA)を、www.linkedin.com/company/indium-corporation/または@IndiumCorp でフォローすることもできます。
About InSIDER Series
Indium Corporations free webinar program designed for professional development, launched in April 2020, has included more than 30 topics presented to thousands of industry professionals via its live sessions and recordings archive. Click here to learn more.
