Indium Corporations Alloy Group R&D Manager Dr. HongWen Zhang will deliver a presentation on the companys award-winning Durafuse mixed-alloy technology as part of its popular InSIDER Series of webinars. The presentation, titled Solder Challenges and Product Development with Durafuse Technology, will be given on Wednesday, April 27 at 8 a.m. San Francisco/11 a.m. New York/4 p.m. London/5 p.m. Germany.
Dr. Zhangs presentation will focus on the shortcomings of traditional solder materials and examine the ability of Indium Corporations Durafuse technology to provide a solution to these challenges. He will highlight the benefits of Durafuse LT, a patented, innovative, low-temperature, mixed-alloy technology that offers enhanced reliability with drop shock performance two orders of magnitude better than Bi-containing solders. He will also discuss Durafuse HT, a new patent-pending product designed as a drop-in solution to replace and outperform the traditional high-lead solders in die-attach and clip-bond applications. Click here to register.
Dr. Zhang is manager of the alloy group in Indium Corporations R&D department. His focus is on the development of Pb-free solder materials and the associated technologies for high-temperature and high-reliability applications. He was instrumental in inventing the mixed-alloy solder technique to combine the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding surface, and control the joints morphology, thus improving reliability.
Dr. Zhang has a bachelors degree in metallurgical physical chemistry from Central South University of China, a masters degree in materials and engineering from the Institute of Metal Research, Chinese Academy of Science, and a masters degree in mechanical engineering and a Ph.D. in material science and engineering from the Michigan Technological University. He has a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, and is a certified IPC Specialist for IPC-A-600 and IPC-A-610 as well as a certified SMT Process Engineer. He has extensive experience in various aluminum (Al) alloys and fiber/particle reinforced Al-based composite materials, and Al-rich and ZrHf-based amorphous alloys. He has co-authored two book chapters on high-temperature lead-free bonding materials, has had a number of patents filed, and has been published in approximately 20 journals in the fields of metallurgy, materials science and engineering, physics, electronics materials, and mechanics.
关于铟泰公司
Indium Corporation 是全球电子、半导体、薄膜和热管理市场的主要材料提炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil 。公司成立于 1934 年，在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国均设有工厂，并提供全球技术支持。
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About InSIDER Series
Indium Corporations free webinar program designed for professional development, launched in April 2020, has included more than 30 topics presented to thousands of industry professionals via its live sessions and recordings archive. Click here to learn more.
