Indium Corporation Product Manager Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA. Paynes presentation, scheduled for May 9, will examine the challenges and benefits of transitioning from high-Pb solder to Pb-free solder for die-attach in discrete power applications.
High-Pb solder has long been the standard material for die-attach in discrete power devices; however, market-leading device manufacturers have been actively working with suppliers to find alternatives. In addition to Pb-free solders, other options are being considered, including TLPS, adhesives, and sinter materials. Focusing on a novel, dual-alloy, high-temperature, Pb-free solder, Payne will explore the pros and cons of the different material options and explain why Pb-free solder shows the most promise as an alternative to high-Pb solutions.
The results and analysis presented will highlight how this new Pb-free solder can outperform Pb-based solder in some aspects of function and reliability, said Payne. With successful customer trials already completed, this new Pb-free solder is ready for industry adoption.
Payne is responsible for driving the profitable growth of Indium Corporations power semiconductor materials, which include high-Pb die-attach paste, high-temperature Pb-free solutions, and sintering materials. He has more than 13 years of experience in semiconductor/wafer fabrication. Dean holds multiple certifications from the University of Wales and Coleg Gwent in the United Kingdom, including the Level 3 National Vocational Qualification in electrical and electronic engineering, the Higher National Certificate in electrical and electronic engineering, and the Higher National Diploma in engineering.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
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