Indium Corporation Product Manager Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA. Paynes presentation, scheduled for May 9, will examine the challenges and benefits of transitioning from high-Pb solder to Pb-free solder for die-attach in discrete power applications.
High-Pb solder has long been the standard material for die-attach in discrete power devices; however, market-leading device manufacturers have been actively working with suppliers to find alternatives. In addition to Pb-free solders, other options are being considered, including TLPS, adhesives, and sinter materials. Focusing on a novel, dual-alloy, high-temperature, Pb-free solder, Payne will explore the pros and cons of the different material options and explain why Pb-free solder shows the most promise as an alternative to high-Pb solutions.
The results and analysis presented will highlight how this new Pb-free solder can outperform Pb-based solder in some aspects of function and reliability, said Payne. With successful customer trials already completed, this new Pb-free solder is ready for industry adoption.
Payne is responsible for driving the profitable growth of Indium Corporations power semiconductor materials, which include high-Pb die-attach paste, high-temperature Pb-free solutions, and sintering materials. He has more than 13 years of experience in semiconductor/wafer fabrication. Dean holds multiple certifications from the University of Wales and Coleg Gwent in the United Kingdom, including the Level 3 National Vocational Qualification in electrical and electronic engineering, the Higher National Certificate in electrical and electronic engineering, and the Higher National Diploma in engineering.
インジウム・コーポレーションについて
インジウム・コーポレーション は、世界のエレクトロニクス、半導体、薄膜、サーマルマネージメント市場向けの一流の材料精製、製錬、製造、サプライヤーである。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil などがある。1934年に設立され、グローバルな技術サポートと中国、ドイツ、インド、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
インジウム・コーポレーションについての詳細は、www.indium.comをご覧いただくか、Jingya HuangまでEメールにてお問い合わせください。また、当社の専門家、From One Engineer To Another (#FOETA)をフォローすることもできます。www.linkedin.com/company/indium-corporation/。
