Indium Corporation has expanded its portfolio of proven pastes with a new no-clean, halogen-free solder paste designed for advanced LED applications, including COB, COG, SMT, and other LED varieties.
LEDPaste NC38HF combines superior wetting performance with excellent stencil print transfer efficiency to satisfy the broadest range of process requirements for miniLED applications. It offers excellent printability down to 60-micron apertures. MiniLEDs typically feature a length of less than 240 microns on the component edge; this material offers excellent compatibility with the current size of miniLEDs and as future die continue to miniaturize.
LEDPaste NC38HF delivers:
- Consistent and tight solder deposit spread across multiple prints and excellent response-to-pause characteristics
- 最小化緊密間距元件的空隙，確保小型元件的接合強度
- Industry-leading non-wet open (NWO) performance using superior oxidation barrier technology, enabling reduced solder ball and solder beading defects and enhanced graping performance
- 增強坍落度性能，在組裝製程中將橋接減至最低，提高緊密間距組件的良率
A proven product, LEDPaste NC38HF was recognized with an award for Excellent Product of the Year at the MiniLED conference in Shenzhen, China on Nov. 10.
For more information about Indium Corporation’s pastes for mini/microLED applications, contact Evan Griffith, product specialist semiconductor and advanced assembly materials.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以透過www.linkedin.com/company/indium-corporation/或@IndiumCorp 追蹤我們的專家，From One Engineer To Another (#FOETA)。
