Indium Corporation has expanded its portfolio of proven pastes with a new no-clean, halogen-free solder paste designed for advanced LED applications, including COB, COG, SMT, and other LED varieties.
LEDPaste NC38HF combines superior wetting performance with excellent stencil print transfer efficiency to satisfy the broadest range of process requirements for miniLED applications. It offers excellent printability down to 60-micron apertures. MiniLEDs typically feature a length of less than 240 microns on the component edge; this material offers excellent compatibility with the current size of miniLEDs and as future die continue to miniaturize.
LEDPaste NC38HF delivers:
- Consistent and tight solder deposit spread across multiple prints and excellent response-to-pause characteristics
- 在间距较小的组件上尽量减少空隙，确保小型组件的连接强度
- Industry-leading non-wet open (NWO) performance using superior oxidation barrier technology, enabling reduced solder ball and solder beading defects and enhanced graping performance
- 增强了坍落度性能，装配过程中的桥接最小，提高了紧凑间距组件的产量
A proven product, LEDPaste NC38HF was recognized with an award for Excellent Product of the Year at the MiniLED conference in Shenzhen, China on Nov. 10.
For more information about Indium Corporation’s pastes for mini/microLED applications, contact Evan Griffith, product specialist semiconductor and advanced assembly materials.
关于铟泰铟泰公司
铟泰公司是全球电子、半导体、薄膜和热管理市场首屈一指的材料精炼商、冶炼商、制造商和供应商。 产品涵盖焊料与助焊剂、硬焊料、热界面材料、溅射靶材、铟、镓、锗、锡等金属及无机化合物，以及NanoFoil™（ ）。公司创立于1934年，拥有全球技术支持体系，工厂遍布中国、德国、印度、马来西亚、新加坡、韩国、英国及美国。
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