Indium Corporation is proud to showcase its proven advanced assembly materials for power electronics, including the rapidly evolving electric vehicle (EV) manufacturing and e-Mobility market, at NEPCON Japan, January 24-26, in Tokyo, Japan. Indium Corporation’s products for power electronics have been demonstrated to reduce energy consumption and solve warpage issues for its customers while ensuring high reliability and improving overall efficiency.
Featured products include:
- InFORMS reinforced solder alloy fabrications that improve mechanical and thermal reliability and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
- Indalloy301LT 爐胚合金/InFORMS嶄新的無鉛合金，與 SAC 合金相比，可降低爐胚焊接的加工溫度。此合金專為電源模組應用而設計，可防止封裝與冷卻器連接時產生翹曲，而不會像傳統含鉍低溫合金一樣犧牲可靠性。可提供預型件、帶狀或 InFORMS 。
- Durafuse HT based on a novel alloy technology, designed to deliver a tin-rich, high-temperature lead-free (HTLF) paste, presenting the merits of both constituent alloys. Durafuse HT delivers simplified processing, with no special equipment needed, and enhanced thermal cycling reliability equal to or higher than a high-Pb solder.
- Durafuse HR based on a novel alloy technology, delivers enhanced thermal cycling performance (-40/125C and -40/150C) and superior voiding performance for high-reliability automotive applications.
- Heat-Spring可壓縮、非回流金屬 TIM，是 TIM2 應用的理想選擇。與非金屬相比，這些含铟 TIM 具有更優異的熱傳導性，其中純金屬鎘在所有平面上的熱傳導性為 86W/mK。由於其已售出的金屬狀態，Heat-Spring 可避免抽氣和烘烤問題。由於我們的铟回收和再循環計劃，它也提供了一個可持續發展的解決方案。
Many of these innovative products are counted within the company’s Rel-ion suite of electrical, mechanical, and thermal solutions to reduce EV manufacturers’ time to market. More than five million EVs are on the road with Indium Corporation’s reliable, scalable, and proven Rel-ion products. Rel-ion materials solutions deliver reliability by:
- 消除非濕式開啟和頭枕式缺陷
- 符合更嚴格的表面絕緣電阻要求，防止樹枝狀生長
- 透過精確的接合線控制防止焊料脫層，並提高抗蠕變和抗疲勞能力
- 透過改善熱效率，減少熱點引起的空洞
To learn more about Indium Corporation’s solutions for power electronics, be sure to visit with our experts at NEPCON Japan.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以在www.linkedin.com/company/indium-corporation/ 追蹤我們的專家，From One Engineer To Another (#FOETA)。
