Indium Corporation‘s Dr. Ning-Cheng Lee, vice president of technology, will present Voiding Control and Reliability of Solder Joints with Backward Compatibility as part of a webinar sponsored by the SMTA on February 7, 2013, from 1-2:30 p.m.
The webinar supports electronics manufacturers as they seek to reduce defects, improve product quality, and increase their profitability.
Dr. Lee will analyze the voiding performance and reliability of a backward compatible system in terms of surface mount technology reflow profiles and alloy combinations, and compare it with tin-lead and lead-free systems.
Dr. Lee has extensive experience in the development of solder pastes, fluxes, high-temperature polymers, microelectronics encapsulants, underfills, and adhesives for electronics assembly. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high-performance and low-cost of ownership. Dr. Lee is an SMTA Member of Distinction and a member of the SMTAI planning committee.
For more information, or to register, visit http://bit.ly/WHcWta.
Die Indium Corporation ist ein führender Materiallieferant für die weltweiten Märkte für Elektronik, Halbleiter, Solar, Dünnschicht und Wärmemanagement. Zu den Produkten gehören Lote, Vorformlinge und Flussmittel, Hartlötungen, Sputtertargets, Metalle und Verbindungen aus Indium, Gallium und Germanium sowie Reactive NanoFoil®. Die 1934 gegründete Indium Corporation verfügt über einen weltweiten technischen Support und Fabriken in China, Singapur, Südkorea, Großbritannien und den USA.
Weitere Informationen über die Indium Corporation erhalten Sie unter www.indium.com oder per E-Mail an [email protected].
