Indium Corporation‘s Dr. Ning-Cheng Lee, vice president of technology, will present Voiding Control and Reliability of Solder Joints with Backward Compatibility as part of a webinar sponsored by the SMTA on February 7, 2013, from 1-2:30 p.m.
The webinar supports electronics manufacturers as they seek to reduce defects, improve product quality, and increase their profitability.
Dr. Lee will analyze the voiding performance and reliability of a backward compatible system in terms of surface mount technology reflow profiles and alloy combinations, and compare it with tin-lead and lead-free systems.
Dr. Lee has extensive experience in the development of solder pastes, fluxes, high-temperature polymers, microelectronics encapsulants, underfills, and adhesives for electronics assembly. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high-performance and low-cost of ownership. Dr. Lee is an SMTA Member of Distinction and a member of the SMTAI planning committee.
For more information, or to register, visit http://bit.ly/WHcWta.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 공급하는 기업입니다. 제품에는 솔더, 프리폼 및 플럭스, 브레이즈, 스퍼터 타겟, 인듐, 갈륨, 게르마늄 금속 및 화합물, 반응성 나노포일® 등이 있습니다. 1934년에 설립된 Indium Corporation은 중국, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인디엄 코퍼레이션에 대한 자세한 내용은 www.indium.com 또는 이메일 ([email protected])로 문의하세요.
