Indium Corporation‘s Dr. Ning-Cheng Lee, vice president of technology, will present Voiding Control and Reliability of Solder Joints with Backward Compatibility as part of a webinar sponsored by the SMTA on February 7, 2013, from 1-2:30 p.m.
The webinar supports electronics manufacturers as they seek to reduce defects, improve product quality, and increase their profitability.
Dr. Lee will analyze the voiding performance and reliability of a backward compatible system in terms of surface mount technology reflow profiles and alloy combinations, and compare it with tin-lead and lead-free systems.
Dr. Lee has extensive experience in the development of solder pastes, fluxes, high-temperature polymers, microelectronics encapsulants, underfills, and adhesives for electronics assembly. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high-performance and low-cost of ownership. Dr. Lee is an SMTA Member of Distinction and a member of the SMTAI planning committee.
For more information, or to register, visit http://bit.ly/WHcWta.
Indium Corporation 是全球電子、半導體、太陽能、薄膜及熱管理市場的主要材料供應商。產品包括焊料、預成型品和助熔劑；钎料；濺鍍靶材；铟、鎵和锗金屬及化合物；以及 Reactive NanoFoil®。Indium Corporation 成立於 1934 年，擁有全球性的技術支援，工廠位於中國、新加坡、南韓、英國和美國。
如需有關 Indium Corporation 的更多資訊，請造訪www.indium.com或發送電子郵件至 [email protected]。
