Indium Corporation‘s Dr. Ning-Cheng Lee, vice president of technology, will present Voiding Control and Reliability of Solder Joints with Backward Compatibility as part of a webinar sponsored by the SMTA on February 7, 2013, from 1-2:30 p.m.
The webinar supports electronics manufacturers as they seek to reduce defects, improve product quality, and increase their profitability.
Dr. Lee will analyze the voiding performance and reliability of a backward compatible system in terms of surface mount technology reflow profiles and alloy combinations, and compare it with tin-lead and lead-free systems.
Dr. Lee has extensive experience in the development of solder pastes, fluxes, high-temperature polymers, microelectronics encapsulants, underfills, and adhesives for electronics assembly. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high-performance and low-cost of ownership. Dr. Lee is an SMTA Member of Distinction and a member of the SMTAI planning committee.
For more information, or to register, visit http://bit.ly/WHcWta.
铟泰公司 是面向全球电子、半导体、太阳能、薄膜及热管理 市场的顶级材料供应商。产品包括焊料、焊片 以及助焊剂；硬钎焊 ；溅射靶材 ；铟、镓（Ga） 以及锗金属和化合物 ；以及Reactive NanoFoil®。铟泰公司 成立于1934年，拥有全球技术支持团队，并在中国、新加坡 、韩国、英国和美国设有工厂。
如需了解有关铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至[email protected]。
