Indium Corporation‘s Dr. Ning-Cheng Lee, vice president of technology, will present Voiding Control and Reliability of Solder Joints with Backward Compatibility as part of a webinar sponsored by the SMTA on February 7, 2013, from 1-2:30 p.m.
The webinar supports electronics manufacturers as they seek to reduce defects, improve product quality, and increase their profitability.
Dr. Lee will analyze the voiding performance and reliability of a backward compatible system in terms of surface mount technology reflow profiles and alloy combinations, and compare it with tin-lead and lead-free systems.
Dr. Lee has extensive experience in the development of solder pastes, fluxes, high-temperature polymers, microelectronics encapsulants, underfills, and adhesives for electronics assembly. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high-performance and low-cost of ownership. Dr. Lee is an SMTA Member of Distinction and a member of the SMTAI planning committee.
For more information, or to register, visit http://bit.ly/WHcWta.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、太陽電池、薄膜および熱管理市場向けの一流材料サプライヤーです。製品には、はんだ、プリフォーム、フラックス、ろう材、スパッタターゲット、インジウム、ガリウム、ゲルマニウムの金属および化合物、Reactive NanoFoil®などがあります。1934年に設立されたインジウム・コーポレーションは、グローバルな技術サポートと中国、シンガポール、韓国、英国、米国に工場を有しています。
インジウム・コーポレーションについての詳細は、www.indium.com、またはEメール（[email protected]）で。
