Indium Corporation’s Wolfgang Bloching, regional sales manager for Germany, Austria, and Switzerland, will present at Yamaha Technology Day on Oct. 1 in Neuss, Germany.
Bloching will present Miniaturization – Solder Paste Attributes for Maximizing the Print & Reflow Manufacturing Process Window. This presentation discusses the development of an optimized flux technology platform to achieve print for small apertures; how to eliminate the head-in-pillow defect with an enhanced oxidation barrier approach; achieving complete solder coalescence and preventing clumpy solder joints; and reducing voiding in electronics assembly.
Bloching is responsible for growing sales of Indium Corporation’s soldering products, including solder paste, solder wire, engineered solder materials, and thermal management materials in Germany, Austria, and Switzerland. He has more than 15 years of experience in electronics manufacturing. Bloching is a German state-certified engineer in the field of electronics and process engineering.
Die Indium Corporation ist ein führender Materialhersteller und -lieferant für die weltweiten Elektronik-, Halbleiter-, Solar-, Dünnschicht- und Wärmemanagementmärkte. Zu den Produkten gehören Lote und Flussmittel, Hartlote, Materialien für thermische Schnittstellen, Sputtertargets, Metalle und anorganische Verbindungen aus Indium, Gallium, Germanium und Zinn sowie NanoFoil®. Das 1934 gegründete Unternehmen verfügt über einen weltweiten technischen Support und Fabriken in China, Malaysia, Singapur, Südkorea, dem Vereinigten Königreich und den USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
