Indium Corporation’s Wolfgang Bloching, regional sales manager for Germany, Austria, and Switzerland, will present at Yamaha Technology Day on Oct. 1 in Neuss, Germany.
Bloching will present Miniaturization – Solder Paste Attributes for Maximizing the Print & Reflow Manufacturing Process Window. This presentation discusses the development of an optimized flux technology platform to achieve print for small apertures; how to eliminate the head-in-pillow defect with an enhanced oxidation barrier approach; achieving complete solder coalescence and preventing clumpy solder joints; and reducing voiding in electronics assembly.
Bloching is responsible for growing sales of Indium Corporation’s soldering products, including solder paste, solder wire, engineered solder materials, and thermal management materials in Germany, Austria, and Switzerland. He has more than 15 years of experience in electronics manufacturing. Bloching is a German state-certified engineer in the field of electronics and process engineering.
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持体系，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解有关铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至[email protected]。
