Indium Corporation‘s Vice President of Technology Dr. Ning-Cheng Lee and Product Manager of PCB Assembly Materials Tim Jensen will present their technical findings at the SMTA South East Asia Technical Conference on Electronics Assembly, April 18-20, 2012 in Penang, Malaysia.
Dr. Lee will instruct two courses. The first, Reliability of Lead-Free Solder Joints, will discuss the best options to achieve reliable lead-free solder joints under various applications. Topics include the failure modes, thermal cycling reliability, and fragility of solder joints as a function of material combination, thermal history, and stress history. A special emphasis will be placed on the understanding of how the various factors contribute to reliability.
Dr. Lee’s second course, Electromigration – The Hurdle For Miniaturization and High Power Devices, explores the electromigration phenomenon in detail and how to prevent electromigration within products. Topics covered include all critical aspects of electromigration of solder joints, including failure mechanism, effect of solder alloy composition, solder joint metallurgy and configuration, pad design, pad composition, current density, temperature, and current polarity. In addition, Dr. Lee will recommend how to achieve long life under high-current stressed conditions for solder joints and redistribution layer through optimized designs.
Tim’s presentation of Alternative Alloys to SAC305 for Lead-Free Assembly will provide a current overview of the state of lead-free alloys from a cost, application, and reliability perspective.
Tim will also present Material and Process Optimization for Head-in-Pillow Optimization, which outlines the causes of head-in-pillow (HIP) and the best practices to reduce such defects.
Dr. Lee ist ein weltweit anerkannter Lötexperte und ein SMTA Member of Distinction. Er verfügt über umfangreiche Erfahrung in der Entwicklung von Hochtemperaturpolymeren, Verkapselungsmitteln für die Mikroelektronik, Underfills und Klebstoffen. Sein derzeitiges Forschungsinteresse gilt fortschrittlichen Materialien für Verbindungen und Verpackungen für elektronische und optoelektronische Anwendungen, wobei der Schwerpunkt auf hoher Leistung und niedrigen Betriebskosten liegt.
As a product manager, Tim works with customers to troubleshoot and optimize SMT process lines. He specializes in SnPb and Pb-free solder paste, halogen-free soldering materials, wave solder fluxes, bar solder, rework fluxes, and flux-cored wire.
Tim is an SMTA-certified process engineer and has earned his bachelor’s degree in chemical engineering from Clarkson University. He readily shares his expertise by authoring technical papers, writing for technical publications, and participates actively in several IPC standards development committees. Tim also authors a blog, which can be found at blogs.indium.com/blog/tim-jensen.
For more information or to register, visit www.smta.org.
Die Indium Corporation ist ein führender Materiallieferant für die weltweiten Märkte für Elektronik, Halbleiter, Solar, Dünnschicht und Wärmemanagement. Zu den Produkten gehören Lote, Vorformlinge und Flussmittel, Hartlötungen, Sputtertargets, Metalle und Verbindungen aus Indium, Gallium und Germanium sowie Reactive NanoFoil®. Die 1934 gegründete Indium Corporation verfügt über einen weltweiten technischen Support und Fabriken in China, Singapur, Südkorea, Großbritannien und den USA.
Weitere Informationen über die Indium Corporation erhalten Sie unter www.indium.com oder per E-Mail an [email protected].
