Indium Corporation‘s Vice President of Technology Dr. Ning-Cheng Lee and Product Manager of PCB Assembly Materials Tim Jensen will present their technical findings at the SMTA South East Asia Technical Conference on Electronics Assembly, April 18-20, 2012 in Penang, Malaysia.
Dr. Lee will instruct two courses. The first, Reliability of Lead-Free Solder Joints, will discuss the best options to achieve reliable lead-free solder joints under various applications. Topics include the failure modes, thermal cycling reliability, and fragility of solder joints as a function of material combination, thermal history, and stress history. A special emphasis will be placed on the understanding of how the various factors contribute to reliability.
Dr. Lee’s second course, Electromigration – The Hurdle For Miniaturization and High Power Devices, explores the electromigration phenomenon in detail and how to prevent electromigration within products. Topics covered include all critical aspects of electromigration of solder joints, including failure mechanism, effect of solder alloy composition, solder joint metallurgy and configuration, pad design, pad composition, current density, temperature, and current polarity. In addition, Dr. Lee will recommend how to achieve long life under high-current stressed conditions for solder joints and redistribution layer through optimized designs.
Tim’s presentation of Alternative Alloys to SAC305 for Lead-Free Assembly will provide a current overview of the state of lead-free alloys from a cost, application, and reliability perspective.
Tim will also present Material and Process Optimization for Head-in-Pillow Optimization, which outlines the causes of head-in-pillow (HIP) and the best practices to reduce such defects.
Lee 博士是世界知名的焊接專家，也是 SMTA 的優秀會員。他在高溫聚合物、微電子封裝材料、底部填充物和粘合劑的開發方面擁有豐富的經驗。他目前的研究興趣涵蓋用於電子和光電應用的互連和封裝的先進材料，強調高性能和低擁有成本。
As a product manager, Tim works with customers to troubleshoot and optimize SMT process lines. He specializes in SnPb and Pb-free solder paste, halogen-free soldering materials, wave solder fluxes, bar solder, rework fluxes, and flux-cored wire.
Tim is an SMTA-certified process engineer and has earned his bachelor’s degree in chemical engineering from Clarkson University. He readily shares his expertise by authoring technical papers, writing for technical publications, and participates actively in several IPC standards development committees. Tim also authors a blog, which can be found at blogs.indium.com/blog/tim-jensen.
For more information or to register, visit www.smta.org.
Indium Corporation 是全球電子、半導體、太陽能、薄膜及熱管理市場的主要材料供應商。產品包括焊料、預成型品和助熔劑；钎料；濺鍍靶材；铟、鎵和锗金屬及化合物；以及 Reactive NanoFoil®。Indium Corporation 成立於 1934 年，擁有全球性的技術支援，工廠位於中國、新加坡、南韓、英國和美國。
如需有關 Indium Corporation 的更多資訊，請造訪www.indium.com或發送電子郵件至 [email protected]。
