Indium Corporation‘s Vice President of Technology Dr. Ning-Cheng Lee and Product Manager of PCB Assembly Materials Tim Jensen will present their technical findings at the SMTA South East Asia Technical Conference on Electronics Assembly, April 18-20, 2012 in Penang, Malaysia.
Dr. Lee will instruct two courses. The first, Reliability of Lead-Free Solder Joints, will discuss the best options to achieve reliable lead-free solder joints under various applications. Topics include the failure modes, thermal cycling reliability, and fragility of solder joints as a function of material combination, thermal history, and stress history. A special emphasis will be placed on the understanding of how the various factors contribute to reliability.
Dr. Lee’s second course, Electromigration – The Hurdle For Miniaturization and High Power Devices, explores the electromigration phenomenon in detail and how to prevent electromigration within products. Topics covered include all critical aspects of electromigration of solder joints, including failure mechanism, effect of solder alloy composition, solder joint metallurgy and configuration, pad design, pad composition, current density, temperature, and current polarity. In addition, Dr. Lee will recommend how to achieve long life under high-current stressed conditions for solder joints and redistribution layer through optimized designs.
Tim’s presentation of Alternative Alloys to SAC305 for Lead-Free Assembly will provide a current overview of the state of lead-free alloys from a cost, application, and reliability perspective.
Tim will also present Material and Process Optimization for Head-in-Pillow Optimization, which outlines the causes of head-in-pillow (HIP) and the best practices to reduce such defects.
이 박사는 세계적으로 유명한 납땜 전문가이자 SMTA 우수 회원입니다. 그는 고온 폴리머, 마이크로일렉트로닉스용 인캡슐런트, 언더필 및 접착제 개발 분야에서 폭넓은 경험을 보유하고 있습니다. 현재 그의 연구 관심 분야는 전자 및 광전자 애플리케이션을 위한 인터커넥트 및 패키징용 첨단 소재이며, 고성능과 낮은 소유 비용에 중점을 두고 있습니다.
As a product manager, Tim works with customers to troubleshoot and optimize SMT process lines. He specializes in SnPb and Pb-free solder paste, halogen-free soldering materials, wave solder fluxes, bar solder, rework fluxes, and flux-cored wire.
Tim is an SMTA-certified process engineer and has earned his bachelor’s degree in chemical engineering from Clarkson University. He readily shares his expertise by authoring technical papers, writing for technical publications, and participates actively in several IPC standards development committees. Tim also authors a blog, which can be found at blogs.indium.com/blog/tim-jensen.
For more information or to register, visit www.smta.org.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 공급하는 기업입니다. 제품에는 솔더, 프리폼 및 플럭스, 브레이즈, 스퍼터 타겟, 인듐, 갈륨, 게르마늄 금속 및 화합물, 반응성 나노포일® 등이 있습니다. 1934년에 설립된 Indium Corporation은 중국, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인디엄 코퍼레이션에 대한 자세한 내용은 www.indium.com 또는 이메일 ([email protected])로 문의하세요.
