Indium Corporation‘s Vice President of Technology Dr. Ning-Cheng Lee and Product Manager of PCB Assembly Materials Tim Jensen will present their technical findings at the SMTA South East Asia Technical Conference on Electronics Assembly, April 18-20, 2012 in Penang, Malaysia.
Dr. Lee will instruct two courses. The first, Reliability of Lead-Free Solder Joints, will discuss the best options to achieve reliable lead-free solder joints under various applications. Topics include the failure modes, thermal cycling reliability, and fragility of solder joints as a function of material combination, thermal history, and stress history. A special emphasis will be placed on the understanding of how the various factors contribute to reliability.
Dr. Lee’s second course, Electromigration – The Hurdle For Miniaturization and High Power Devices, explores the electromigration phenomenon in detail and how to prevent electromigration within products. Topics covered include all critical aspects of electromigration of solder joints, including failure mechanism, effect of solder alloy composition, solder joint metallurgy and configuration, pad design, pad composition, current density, temperature, and current polarity. In addition, Dr. Lee will recommend how to achieve long life under high-current stressed conditions for solder joints and redistribution layer through optimized designs.
Tim’s presentation of Alternative Alloys to SAC305 for Lead-Free Assembly will provide a current overview of the state of lead-free alloys from a cost, application, and reliability perspective.
Tim will also present Material and Process Optimization for Head-in-Pillow Optimization, which outlines the causes of head-in-pillow (HIP) and the best practices to reduce such defects.
リー博士は世界的に著名なはんだ付けの専門家であり、SMTAの特別会員でもある。高温ポリマー、マイクロエレクトロニクス用封止材、アンダーフィル、接着剤の開発に豊富な経験を持つ。現在の研究テーマは、エレクトロニクスおよびオプトエレクトロニクス用途の相互接続およびパッケージング用の先端材料で、高性能と低所有コストの両方に重点を置いている。
As a product manager, Tim works with customers to troubleshoot and optimize SMT process lines. He specializes in SnPb and Pb-free solder paste, halogen-free soldering materials, wave solder fluxes, bar solder, rework fluxes, and flux-cored wire.
Tim is an SMTA-certified process engineer and has earned his bachelor’s degree in chemical engineering from Clarkson University. He readily shares his expertise by authoring technical papers, writing for technical publications, and participates actively in several IPC standards development committees. Tim also authors a blog, which can be found at blogs.indium.com/blog/tim-jensen.
For more information or to register, visit www.smta.org.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、太陽電池、薄膜および熱管理市場向けの一流材料サプライヤーです。製品には、はんだ、プリフォーム、フラックス、ろう材、スパッタターゲット、インジウム、ガリウム、ゲルマニウムの金属および化合物、Reactive NanoFoil®などがあります。1934年に設立されたインジウム・コーポレーションは、グローバルな技術サポートと中国、シンガポール、韓国、英国、米国に工場を有しています。
インジウム・コーポレーションについての詳細は、www.indium.com、またはEメール（[email protected]）で。
