Halbleiter-Flussmittel
Flip-Chip Fluxes
Indium Corporation produces high-quality, advanced fluxes for flip-chip component assembly, designed to meet the demands of cutting-edge semiconductor devices. These fluxes address common challenges of miniaturization, such as thin or warped substrates and fine-pitch, high I/O count assembly. Indium Corporation offers fluxes in both water-soluble formulations and ultra-low residue no-clean options, which provides a sustainable, low-residue alternative to traditional water-soluble fluxes.
Angetrieben von der Indium Corporation
- Water-Wash or Ultra-Low Residue
- Broad Compatibility
- Suitable for Dip, Pin Transfer, and Printing
Produktübersicht
Ultra-Low Residue, No-Clean Flux
Indium Corporation is the market leader in the use of ultra-low residue (ULR), no-clean flip chip fluxes in high volume manufacturing. These fluxes are meant to be treated as a no-clean flux but with a benign, clear residue that is compatible with a wide variety of underfill materials. Eliminating the cleaning process is ideal for components with very low standoff heights or fine pitches.
Underfill Compatibility
Both of Indium Corporation’s water-soluble and ULR no-clean fluxes are compatible with a wide range of underfill materials, offering strong mechanical reliability with no risk of delamination after application.
Application Methods
Indium Corporation’s flip-chip fluxes are compatible with a wide variety of application methods, including flux dipping, pin transfer, and stencil printing. The working life of all fluxes is designed to last a complete shift to avoid material replenishment.
Eigenschaften
Flip-Chip Flux Products
- Applied by dipping or spraying
- Reflow in inert atmosphere (typically <50 ppm 02 level)
- Designed to be used in specific applications, from standard, large pitch solder bumps onto ENIG surfaces, to ultrafine pitch microbumps onto copper OSP, mass reflow, and TCB processes
- Ultra-low residue no-clean fluxes with controlled solderability and compatible with wide variety of underfill materials
| Material | Paste Flux Type* | Paste Application Method | Beschreibung | Reinigungsmethode | Halogenfrei |
|---|---|---|---|---|---|
| WS-575-SP | WS | Jetting/Spraying | SnPb-eutectic and SnAg onto SOP for logic flip-chip | Warm DI water, may need surfactant for finer pitch applications | Ja |
| FC-NC-HT-A1 | NC-NZR | Jetting/Spraying | Mass reflow flux compatible with CUF | No-clean | Ja |
| WS-446 | WS | Dipping | General purpose for multi-core logic flip-chip | Warm DI water, may need surfactant for finer pitch applications | Nein |
| WS-688 | WS | Dipping | Eliminates voiding on probe-test indents in flip-chip bumps | Warm DI water, may need surfactant for finer pitch applications | Ja |
| WS-446HF | WS | Dipping | Good wetting onto copper OSP | Warm/RT DI water, may need surfactant for finer pitch applications | Ja |
| WS-641 | WS | Dipping | For chip-on-wafer (CoW), Cu-pillar bump flip-chip die-attach application | Warm/RT DI water, may need surfactant for finer pitch applications | Ja |
| WS-910 | WS | Dipping | Leicht zu reinigende Rückstände, was zu klassenbester CUF/MUF-Kompatibilität nach der Reinigung führt | Warm/RT DI water, may need surfactant for finer pitch applications | Ja |
| NC-26-A NC-26S | NC-ULR | Dipping | Controlled solderability, compatible with wide variety of CUF/MUF | No-clean | Ja |
| NC-809 | NC-ULR | Dipping | Enhanced wetting, compatible with wide variety of CUF/MUF | No-clean | Ja |
| NC-699 | NC-NZR | Dipping | Controlled solderability, compatible with wide variety of CUF/MUF | No-clean | Ja |
Produktdatenblätter
Flip-Chip Flux NC-26AU PDS 100187 R1
WS-831 Cu-Säule Flip-Chip Flussmittel PDS 99609 R1.pdf
WS-910 Flip-Chip Flux PDS 100324 R1.pdf
WS-575-SP Flip-Chip-Flussmittel PDS 98680 R2.pdf
Verwandte Anwendungen
Flip-Chip Flux products are available for use in a variety of applications.
Verpackung und Montage von Halbleitern
Kritische Halbleiterverpackungen gewährleisten Funktionalität und Langlebigkeit.
2,5D- und 3D-Verpackungen
Verfahren zur Integration mehrerer Chips in einem…
Flip-Chip
Eine entscheidende Technik in der modernen Halbleiterverpackung.
SiP und heterogene Integrationsmontage (HIA)
System-in-Package (SiP) und heterogene Integrationslösungen
PCB-Montage
Bewährte und hochmoderne Materialien für die Leiterplattenbestückung…
Verwandte Märkte
There are many markets where Indium Corporation’s Flip-Chip Fluxes are suitable for use.
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