倒装芯片通量

Indium Corporation produces high-quality, advanced fluxes for flip-chip component assembly, designed to meet the demands of cutting-edge semiconductor devices. These fluxes address common challenges of miniaturization, such as thin or warped substrates and fine-pitch, high I/O count assembly. Indium Corporation offers fluxes in both water-soluble formulations and ultra-low residue no-clean options, which provides a sustainable, low-residue alternative to traditional water-soluble fluxes.

由铟泰公司提供支持

水洗或超低残留物
广泛的兼容性
适用于浸渍、针转印和印刷

产品概览

超低残留、免清洗助焊剂

Indium Corporation is the market leader in the use of ultra-low residue (ULR), no-clean flip chip fluxes in high volume manufacturing. These fluxes are meant to be treated as a no-clean flux but with a benign, clear residue that is compatible with a wide variety of underfill materials. Eliminating the cleaning process is ideal for components with very low standoff heights or fine pitches.

底部填充兼容性

Both of Indium Corporation’s water-soluble and ULR no-clean fluxes are compatible with a wide range of underfill materials, offering strong mechanical reliability with no risk of delamination after application.

应用方法

Indium Corporation’s flip-chip fluxes are compatible with a wide variety of application methods, including flux dipping, pin transfer, and stencil printing. The working life of all fluxes is designed to last a complete shift to avoid material replenishment.

特点

2.5D

Indium Corporation’s fluxes are widely used in advanced 2.5D chip on wafer packaging technology.

10%

Indium Corporation’s ULR fluxes leave less than 10% residue by mass, which avoids poor compatibility with underfill materials.

倒装芯片助焊剂产品

浸渍或喷涂
Reflow in inert atmosphere (typically <50 ppm 02 level)
设计用于特定应用，从 ENIG 表面上的标准大间距焊接凸点，到 OSP 铜、大规模回流焊和 TCB 工艺上的超细间距微凸点
超低残留免清洗助焊剂具有可控焊接性，与多种底部填充材料兼容

材料	焊膏助焊剂类型*	粘贴应用法	说明	清洁方法	无卤素
WS-575-SP	WS	喷射/喷洒	用于逻辑倒装芯片的 SOP 上的锡铅共晶和锡银	温 DI 水，可能需要表面活性剂用于更细的沥青应用	是
FC-NC-HT-A1	NC-NZR	喷射/喷洒	与 CUF 兼容的大量回流焊通量	免清洗	是
WS-446	WS	浸渍	通用型多核逻辑倒装芯片	温 DI 水，可能需要表面活性剂用于更细的沥青应用	没有
WS-688	WS	浸渍	消除倒装芯片凸块中探针测试压痕上的空洞	温 DI 水，可能需要表面活性剂用于更细的沥青应用	是
WS-446HF	WS	浸渍	在铜 OSP 上具有良好的润湿性	温水/RT DI 水，对于较细的沥青应用可能需要表面活性剂	是
WS-641	WS	浸渍	用于片上晶片 (CoW)、铜柱凸点倒装芯片芯片连接应用	温水/RT DI 水，对于较细的沥青应用可能需要表面活性剂	是
WS-910	WS	浸渍	残留物易于清洁，清洁后的 CUF/MUF 兼容性一流	温水/RT DI 水，对于较细的沥青应用可能需要表面活性剂	是
NC-26-A NC-26S	NC-ULR	浸渍	可控焊接性，与各种 CUF/MUF 兼容	免清洗	是
NC-809	NC-ULR	浸渍	增强润湿性，与各种 CUF/MUF 兼容	免清洗	是
NC-699	NC-NZR	浸渍	可控焊接性，与各种 CUF/MUF 兼容	免清洗	是