半导体助焊剂

Flip-Chip Fluxes

Indium Corporation produces high-quality, advanced fluxes for flip-chip component assembly, designed to meet the demands of cutting-edge semiconductor devices. These fluxes address common challenges of miniaturization, such as thin or warped substrates and fine-pitch, high I/O count assembly. Indium Corporation offers fluxes in both water-soluble formulations and ultra-low residue no-clean options, which provides a sustainable, low-residue alternative to traditional water-soluble fluxes.

技术支持：铟泰公司

Water-Wash or Ultra-Low Residue
广泛的兼容性
适用于浸渍、针转印和印刷

产品概览

Ultra-Low Residue, No-Clean Flux

Indium Corporation is the market leader in the use of ultra-low residue (ULR), no-clean flip chip fluxes in high volume manufacturing. These fluxes are meant to be treated as a no-clean flux but with a benign, clear residue that is compatible with a wide variety of underfill materials. Eliminating the cleaning process is ideal for components with very low standoff heights or fine pitches.

Underfill Compatibility

Both of Indium Corporation’s water-soluble and ULR no-clean fluxes are compatible with a wide range of underfill materials, offering strong mechanical reliability with no risk of delamination after application.

Application Methods

Indium Corporation’s flip-chip fluxes are compatible with a wide variety of application methods, including flux dipping, pin transfer, and stencil printing. The working life of all fluxes is designed to last a complete shift to avoid material replenishment.

特点

2.5D

Indium Corporation’s fluxes are widely used in advanced 2.5D chip on wafer packaging technology.

10%

Indium Corporation’s ULR fluxes leave less than 10% residue by mass, which avoids poor compatibility with underfill materials.

Flip-Chip Flux Products

Applied by dipping or spraying
Reflow in inert atmosphere (typically <50 ppm 02 level)
Designed to be used in specific applications, from standard, large pitch solder bumps onto ENIG surfaces, to ultrafine pitch microbumps onto copper OSP, mass reflow, and TCB processes
Ultra-low residue no-clean fluxes with controlled solderability and compatible with wide variety of underfill materials

材料	焊膏助焊剂类型*	Paste Application Method	说明	清洁方法	Halogen-Free
WS-575-SP	WS	Jetting/Spraying	SnPb-eutectic and SnAg onto SOP for logic flip-chip	Warm DI water, may need surfactant for finer pitch applications	是
FC-NC-HT-A1	NC-NZR	Jetting/Spraying	Mass reflow flux compatible with CUF	No-clean	是
WS-446	WS	浸渍	General purpose for multi-core logic flip-chip	Warm DI water, may need surfactant for finer pitch applications	没有
WS-688	WS	浸渍	Eliminates voiding on probe-test indents in flip-chip bumps	Warm DI water, may need surfactant for finer pitch applications	是
WS-446HF	WS	浸渍	Good wetting onto copper OSP	Warm/RT DI water, may need surfactant for finer pitch applications	是
WS-641	WS	浸渍	For chip-on-wafer (CoW), Cu-pillar bump flip-chip die-attach application	Warm/RT DI water, may need surfactant for finer pitch applications	是
WS-910	WS	浸渍	Easily cleanable residue, leading to best-in-class CUF/MUF compatibility post-clean	Warm/RT DI water, may need surfactant for finer pitch applications	是
NC-26-A NC-26S	NC-ULR	浸渍	Controlled solderability, compatible with wide variety of CUF/MUF	No-clean	是
NC-809	NC-ULR	浸渍	Enhanced wetting, compatible with wide variety of CUF/MUF	No-clean	是
NC-699	NC-NZR	浸渍	Controlled solderability, compatible with wide variety of CUF/MUF	No-clean	是