Two Indium Corporation experts were honored with a Best Paper Award at the International Microsystems, Packaging, Assembly, and Circuits Conference (IMPACT) 2018, October 24-26, in Taipei, Taiwan.
Dr. Ning-Cheng Lee, Vice President of Technology, presented Nano-Cu Sintering Paste for High Power Devices Die-Attach Applications at IMPACT 2017. The paper, co-authored by Research Scientist Dr. Min Yao, examined how a nano-Cu pressureless sintering paste, developed specifically for joint formation applications, performed when subjected to a variety of tests for oxidation resistance.
The Best Paper selection process involved a three-stage review process, which included abstract, full paper, and onsite oral presentation. More than 180 papers were reviewed and judged for this award.
Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and IEEE Fellow. He has extensive experience in the development of fluxes, alloys, and solder pastes for SMT, and extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials.
Dr. Yao joined Indium Corporation in 2015. She has experience in the research and development of products for the electronics industry. Dr. Yao received a bachelor’s degree in chemistry from Anqin Normal University, and a doctorate in chemistry from Huazhong Normal University.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Sus productos incluyen soldaduras y fundentes, soldaduras fuertes, materiales de interfaz térmica, cátodos para sputtering, metales y compuestos inorgánicos de indio, galio, germanio y estaño, y NanoFoil®. Fundada en 1934, la empresa cuenta con asistencia técnica mundial y fábricas en China, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
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