Two Indium Corporation experts were honored with a Best Paper Award at the International Microsystems, Packaging, Assembly, and Circuits Conference (IMPACT) 2018, October 24-26, in Taipei, Taiwan.
Dr. Ning-Cheng Lee, Vice President of Technology, presented Nano-Cu Sintering Paste for High Power Devices Die-Attach Applications at IMPACT 2017. The paper, co-authored by Research Scientist Dr. Min Yao, examined how a nano-Cu pressureless sintering paste, developed specifically for joint formation applications, performed when subjected to a variety of tests for oxidation resistance.
The Best Paper selection process involved a three-stage review process, which included abstract, full paper, and onsite oral presentation. More than 180 papers were reviewed and judged for this award.
Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and IEEE Fellow. He has extensive experience in the development of fluxes, alloys, and solder pastes for SMT, and extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials.
Dr. Yao joined Indium Corporation in 2015. She has experience in the research and development of products for the electronics industry. Dr. Yao received a bachelor’s degree in chemistry from Anqin Normal University, and a doctorate in chemistry from Huazhong Normal University.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがある。1934年に設立され、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
