Indium Corporation will feature its Flip-Chip Flux WS-446HF and Ball Attach Flux WS-823 at SEMICON Taiwan 2018 Sept. 5-7 in Taipei, Taiwan.
Indium Corporation’s WS-446HF is a water-soluble, halogen-free flip-chip dipping flux with an activator system powerful enough to promote wetting on the most demanding surfaces; from solder-on-pad (SoP) to standard and embedded trace substrates (ETS) and flip-chip on leadframe applications. WS-446HF provides uniform dipping performance over extended periods of time. It also exhibits tackiness that is suitable for holding large die in place during assembly.
WS-823 is a water-soluble, halogen-free ball-attach flux designed for use in pin transfer and printing applications for ball attachment to substrates (BGA manufacturing). WS-823 has an activator system powerful enough to promote wetting on the most demanding substrate metallizations, such as copper OSP. WS-823 is cleanable with just DI water only.
Desde fundentes para flip-chip solubles en agua y sin limpieza, con residuos ultrabajos o casi nulos, hasta pastas de soldadura solubles en agua y sin limpieza para sistemas en paquete (SiP), Indium Corporation cuenta con una gama de productos contrastada en el sector que responde a los retos actuales y en constante evolución que plantean las aplicaciones de SiP de paso fino y de integración heterogénea.
For more information on Indium Corporation’s materials for SiP, visit indiumstg.wpenginepowered.com/SiP or visit Indium Corporation’s booth J2240.
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