Indium Corporation’s Andy C. Mackie, PhD, MSc, will share his expertise at the IMAPS Advanced Technology Workshop on Packaging the Next Generation of Nano Devices April 30-May 1 in Albany, N.Y.
Dr. Mackie’s presentation, Wafer Bumping Fluxes Enabling 2.5D and 3D Technology, examines the theoretical and experimental spin coating processes used to coat semiconductor wafers with different materials, including photoresists and bump fusion fluxes.
Dr. Mackie is an electronics industry expert in physical chemistry, surface chemistry, rheology, and semiconductor assembly materials and processes. He has over 20 years of experience in new product and process development, and materials marketing in all areas of electronics manufacturing, from wafer fabrication to semiconductor packaging and electronics assembly. Andy has a doctorate in physical chemistry from the University of Nottingham, UK, and a master of science (MSc) in colloid and interface science from the University of Bristol, UK. Additionally, he is formally trained in Six Sigma – Design of Experiments.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, la energía solar, la capa fina y la gestión térmica. Sus productos incluyen soldaduras, preformas y fundentes; soldaduras fuertes; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio y germanio; y NanoFoil®. Fundada en 1934, Indium cuenta con asistencia técnica mundial y fábricas en China, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
