Indium Corporation has earned Electronics Manufacturing (EM) World‘s Innovation Award for SiPaste C201HF, a halogen-free, cleanable solder paste specifically formulated to accommodate fine feature printing processes, as seen with 01005 and 008004 components.
El programa EM Innovation Award reconoce y celebra la excelencia en el sector de la electrónica, animando a las empresas a alcanzar los niveles más altos e impulsar la industria.
“We are honored to have SiPaste C201HF be recognized by EM World,” said Evan Griffith, Product Specialist Semiconductor and Advanced Assembly Materials. “Our Semiconductor Assembly Materials team has been working very hard to ensure that our materials meet and exceed customer expectations, and this product is reflective of that effort. As semiconductor manufacturing processes continue to advance, soldering materials need to be compatible with a wide process window to avoid costly product failures; SiPaste C201HF is one example of how Indium Corporation is meeting these advanced challenges.”
SiPaste C201HF combines superior, industry-leading non-wet open (NWO) performance with excellent stencil print transfer efficiency to satisfy the broadest range of process requirements and boost SPI yields. It leaves behind a cleanable residue, able to be removed with a commercially available semi-aqueous cleaning solution, or it can be used as a standard no-clean paste in processes where post-reflow cleaning is not applicable. It also features excellent transfer efficiency on fine feature apertures, with consistent process yields below 80m.
Additionally, SiPaste C201HF delivers:
- Consistent and tight solder deposit spread across multiple prints; excellent response-to-pause performance
- Minimal voiding on tight-pitch components, ensuring joint strength on small components
- Excellent reflow performance on components that exhibit high warpage
- Enhanced slump performance with minimal bridging during the assembly process, improving yields for tight-pitch components
- Flexible cleaning; can be used in processes that require cleaning with a saponifier or that do not require cleaning
For more information about Indium Corporation’s pastes for fine feature printing, contact Evan Griffith.
Acerca de Indium Corporation
Indium Corporation es un importante refinador, fundidor, fabricante y proveedor de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Sus productos incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio, germanio y estaño; y NanoFoil. Fundada en 1934, la empresa cuenta con asistencia técnica mundial y fábricas en China, Alemania, India, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
Para más información sobre Indium Corporation, visite www.indium.com o envíe un correo electrónico a Jingya Huang. También puede seguir a nuestros expertos, From One Engineer To Another (#FOETA), en www.linkedin.com/company/indium-corporation/ o @IndiumCorp.
Acerca de Electronics Manufacturing (EM) World
EM World ofrece la información más reciente del sector a los profesionales que se dedican al diseño, montaje y pruebas de componentes de PCB en Asia; también se ha convertido en fabricante por contrato (EMS/ODM) y empresa OEM y les proporciona equipos, materiales y software. Se considera la revista autorizada para conocer las últimas tendencias de desarrollo de SMT, embalaje electrónico y tecnología de interconexión con el proveedor/agente de soluciones globales.
