As one of the leading materials providers in the electronics assembly and solder industries, Indium Corporation® is proud to feature its lineup of high-reliability products at PCIM Europe, taking place May 6-8, in Nuremberg, Germany.
Indium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly. Central to this innovation is Indium Corporation’s Fluxless Assembly Solder Technology (FAST), which provides high-reliability, flux-free soldering solutions for next-generation power electronics.
With a commitment to the full scope of power electronics applications, Indium Corporation offers the right-sized options to align with nearly every application requirement, with a focus on sustainable, energy-efficient technology solutions. The company will showcase the following among its featured products:
Pb-Free Innovations:
- Durafuse® HT esuna innovadora solución sin plomo diseñada para ofrecer una pasta sin plomo para altas temperaturas (HTLF) destinada a dispositivos discretos de electrónica de potencia.Durafuse® HT puedeintegrarse directamente en el proceso actual de pasta de fijación de chips con alto contenido en plomo, sin necesidad de equipamiento especial. Tanto el rendimiento funcional como la fiabilidad frente a los ciclos térmicos son iguales o superiores a los de una soldadura con alto contenido en plomo.
- Indalloy®301LT for Preforms/InFORMS® is a novel Pb-free alloy that enables lower reflow processing temperatures compared to SAC alloys, preventing delamination and reducing warpage in package-attach soldering applications.
Die-Attach Solutions:
- InFORCE® Pressure Sinter Pastes are high-metal, low-organic content sinter materials available in both silver and copper. The benefits of a low-organic content composition include short drying for increased throughput and less volume reduction between wet and post-sintered deposits, meaning less paste can be used. The portfolio includes:
- InFORCE®29 – a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE®29 include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers.
- InFORCE®MF – a proven pressure Ag sinter paste designed for SiC die-attach application. InFORCE®MF is specially formulated for printing and dry-placement processes. This paste offers outstanding die shear strength, thermal conductivity, and mechanical reliability.
- Award-winning InFORMS® are reinforced solder preforms that improve mechanical strength and produce consistent bondline thickness for superior reliability performance compared to traditional solder preforms, particularly in power module applications.
- InTACK® esuna solución adhesiva que no requiere limpieza, no deja residuos y no contiene halógenos, desarrollada para mantener las piezas en su sitio durante los procesos de colocación y reflujo.
Thermal Reliability:
- Indalloy®276 is a unique lead-free solder alloy that offers a wide service temperature capability and improved reliability up to 175°C. It has demonstrated high-reliability performance while also being capable at both moderate and high service temperature conditions.
- Durafuse® HR, a trusted and proven solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
To learn more about Indium Corporation’s power electronics and solder solutions, visit indiumstg.wpenginepowered.com or visit our experts at PCIM Europe in hall 6, booth #358.
Acerca de Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
Para obtener más información sobre Indium Corporation, visita indiumstg.wpenginepowered.com o envía un correo electrónico a [email protected]. También puedes seguir a nuestros expertos, From One Engineer ToAnother® (#FOETA), en www.linkedin.com/company/indium-corporation/.
