As one of the leading materials providers in the electronics assembly and solder industries, Indium Corporation® is proud to feature its lineup of high-reliability products at PCIM Europe, taking place May 6-8, in Nuremberg, Germany.
Indium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly. Central to this innovation is Indium Corporation’s Fluxless Assembly Solder Technology (FAST), which provides high-reliability, flux-free soldering solutions for next-generation power electronics.
With a commitment to the full scope of power electronics applications, Indium Corporation offers the right-sized options to align with nearly every application requirement, with a focus on sustainable, energy-efficient technology solutions. The company will showcase the following among its featured products:
Pb-Free Innovations:
- Durafuse® HT is an innovative Pb-free solution designed to deliver a high-temperature lead-free (HTLF) paste for discrete power electronics devices. Durafuse® HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than a high-Pb solder.
- Indalloy®301LT for Preforms/InFORMS® is a novel Pb-free alloy that enables lower reflow processing temperatures compared to SAC alloys, preventing delamination and reducing warpage in package-attach soldering applications.
Die-Attach Solutions:
- InFORCE® Pressure Sinter Pastes are high-metal, low-organic content sinter materials available in both silver and copper. The benefits of a low-organic content composition include short drying for increased throughput and less volume reduction between wet and post-sintered deposits, meaning less paste can be used. The portfolio includes:
- InFORCE®29 – a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE®29 include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers.
- InFORCE®MF – a proven pressure Ag sinter paste designed for SiC die-attach application. InFORCE®MF is specially formulated for printing and dry-placement processes. This paste offers outstanding die shear strength, thermal conductivity, and mechanical reliability.
- Award-winning InFORMS® are reinforced solder preforms that improve mechanical strength and produce consistent bondline thickness for superior reliability performance compared to traditional solder preforms, particularly in power module applications.
- InTACK® is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes.
Thermal Reliability:
- Indalloy®276 is a unique lead-free solder alloy that offers a wide service temperature capability and improved reliability up to 175°C. It has demonstrated high-reliability performance while also being capable at both moderate and high service temperature conditions.
- Durafuse® HR, a trusted and proven solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
To learn more about Indium Corporation’s power electronics and solder solutions, visit indiumstg.wpenginepowered.com or visit our experts at PCIM Europe in hall 6, booth #358.
关于铟泰铟泰公司
铟泰公司®是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至[email protected]。您还可以通过www.linkedin.com/company/indium-corporation/ 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
