焊料合金
Indalloy®301LT
Low-temperature, lead-free alloy technology reduces thermal stress and conserves energy during electronics manufacturing. When combined with Indium’s solder preforms, solder paste, and wire products, it provides a more efficient and sustainable solution.
技术支持：铟泰公司
- Lower Processing Temperatures
- Enables Step Soldering
- 减少能源消耗
产品概览
Reflow Peak Temperature Below 220°C
With lower process temperatures compared to traditional lead-free alloys, Indalloy®301LT prevents thermal defects such as warpage or delamination within electronics packaging.
坚实的热性能
For temperature-sensitive thermal interface applications, Indalloy®301LT enables soldering as an alternative to leverage the high thermal conductivity of a metals-based solution compared to conventional organic TIMs.
无铅无铋
Future-proof, ROHS-compliant technology with robust mechanical properties enables low-temperature soldering without sacrificing reliability compared to traditional bismuth-containing alloys.
Reliability Delivered
Tested against AQG-324 for automotive power electronics, Indalloy®301LT offers reliable performance in applications that must balance mission profile demands and processing temperatures.
概况
Indalloy®301LT is specifically designed to reduce processing temperatures in lead-free soldering applications:
Indalloy®301LT Specifications
| Selected Properties | 公制 |
|---|---|
| Solidus | 190°C |
| Liquidus | 205°C |
| Density | 7.4 g/cc |
| Electrical Conductivity | 11% IACS |
| Thermal Conductivity | 43W/m C |
| Tensile Strength | 8,360psi |
| Young’s Module | 52GPa |
| Thermal Shock | -40°C–125°C per AQG324* |
*Pending qualification
产品数据表
Indalloy®301 for Wire and Bar PDS 100189 R1.pdf
Indalloy®301LT for Preforms and InFORMS® PDS 100089 R4.pdf
相关应用
Indalloy®301LT is suitable for a variety of applications.
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相关市场
Indium Corporation’s Indalloy®301LT is available for use in a wide range of applications.
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