現今的電子產品持續變得越來越小，因此傳統的類型 3 (-200/+325) 網格尺寸對於新的擴充應用來說可能過大。將 AuSn 焊膏用於研發應用進行放大，然後在生產中轉換為 AuSn 焊料預型件的情況並不罕見。大多數 AuSn 焊料預型件應用於密封和晶片連接，厚度為 0.001" 或以下。類型 3 中的顆粒厚度範圍為 0.001"- 0.0018"。
我們提供的顆粒尺寸低至類型 7（顆粒尺寸為 2-11µm），用於點膠更小的孔徑。在決定焊膏點膠針的尺寸時，粒度也是一個重要的因素。
以下是焊膏用 80Au20Sn 粉末的顆粒尺寸概覽：
如果您有興趣進一步瞭解 Indium Corporation 的 AuSn 焊膏，或想要討論您的應用，請寄電子郵件至 [email protected]。
謝謝、
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