如今的电子产品体积越来越小，因此传统的 3 型（-200/+325）网孔尺寸对于新的放大生产来说可能过大。在研发应用中使用 AuSn 焊膏进行放大，然后在生产中转换为 AuSn 焊料预型件的情况并不少见。大多数用于密封和芯片连接的 AuSn 焊料预型件厚度都在 0.001 英寸或以下。类型 3 中的颗粒厚度范围为 0.001"- 0.0018"。
我们提供的粒度小到 7 型（2-11µm 粒度），可为较小的孔径分配较小的沉积物。在确定焊膏点胶针的尺寸时，粒度也起着重要作用。
以下是用于焊膏的 80Au20Sn 粉末的粒度概览：
If you are interested in learning more about Indium Corporation's AuSn solder paste, or want to discuss your application, please email me at [email protected].
谢谢、
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