Indium Corporation will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, San Diego, Calif., June 1116.
Indium Corporation 是雷射與光學應用領域的領先焊料供應商。對於需要高熔點接模焊料的應用，金基合金是確保最佳性能和可靠性的最佳選擇。除了滿足高可靠性應用嚴苛的熱能與電氣要求外，它們還能提供最堅固的耐腐蝕與抗氧化焊點。
半導體雷射晶粒接合應用需要最高品質、超精密的焊料預型件，以確保組裝過程中的精確度和可重複性，從而保證高可靠性的終端產品。Indium Corporation 的金基 PDA 預製件提供最高等級的品質，可在關鍵、高可靠性的晶粒接合應用中提供最佳效能。特性包括
- 高精度厚度控制
- 精密的邊緣品質，幾乎沒有毛刺
- 最佳化的清潔度控制
- 預設華夫包方式
Indium Corporation 的金 PDA 預型件有下列合金可供選擇：
- 80Au20Sn, 79Au21Sn, 78Au22Sn, 75Au25Sn
- 88Au12Ge
- 82Au18In
- 96.8Au3.2Si
Indium Corporation’s AuLTRA 75 is an off-eutectic AuSn preform solution (75Au25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA 75 helps improve the operation of these critical technologies by adjusting the final solder joint composition, and improving wetting and voiding. The AuLTRA product line also comes in 78Au22Sn and 79Au21Sn compositions.
Indium Corporation’s AuLTRA ThInFORMS are 0.00035″ thick (0.00889mm or 8.89m) 80Au20Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA ThInFORMS help combat common issues such as:
- 短路縮小的焊料體積可抑制焊料滲入晶片，將短路風險降至最低。
- Poor thermal transferthe ultra-thin 0.00035″ preform reduces bondline thickness (BLT), thus improving thermal transfer and increasing the longevity and performance of the device
A leading gold solder innovator, Indium Corporation’s gold-based portfolio includes wire, paste, preforms, spheres, shot, and ribbon manufactured with cutting-edge technology to ensure supreme quality and the utmost precision. The most commonly used gold-based alloy is 80Au20Sn: the pillar alloy of the microelectronics industry with a melting point of 280C, 80Au20Sn works great in the majority of die-attach and lid sealing applications. It exhibits good thermal fatigue properties and is used in many applications that require high tensile strength and high corrosive resistance. Indium Corporation’s AuSn solder offers numerous benefits including:
- 所有焊料中最高的拉伸強度
- 與後續回流製程相容的高熔點
- 優異的熱傳導性
- 耐腐蝕性
To learn more about Indium Corporation’s precision Au-based preforms, visit www.indium.com/products/solders/gold/gold-preforms or stop by booth #1423 at the show.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以透過www.linkedin.com/company/indium-corporation/或@IndiumCorp 追蹤我們的專家，From One Engineer To Another (#FOETA)。
關於國際微波研討會
For over 70 years, IMS has brought together a unique mix of international RF and microwave experts presenting the latest research and showcasing the newest products and services. IMS includes education and networking opportunities as well as an exhibition. Learn more at ims-ieee.org.
