As a trusted leader in materials science for advanced electronics assembly, Indium Corporation® is proud to showcase its innovative power electronics solutions at SEMICON Southeast Asia 2025, May 20–22, in Marina Bay Sands, Singapore.
Indium Corporation is a trusted expert in power device packaging, delivering a broad portfolio of advanced material solutions designed to support every stage of assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly. Central to these innovations is Indium Corporation’s Fluxless Assembly Solder Technology (FAST), offering high-reliability, flux-free soldering solutions tailored for the demands of next-generation power electronics.
Indium Corporation will showcase a wide range of cutting-edge solutions designed to meet the thermal, mechanical, and reliability demands of modern power electronics systems, including:
- InFORCE®29 is a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE®29 include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers.
- Indalloy®301LT for Preforms/InFORMS® is a novel Pb-free alloy that enables lower reflow processing temperatures compared to SAC alloys, preventing delamination and reducing warpage in package-attach soldering applications.
- InTACK® is a no-clean, no-residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes.
- Heat-Spring®HSxes un TIM metálico compresible y sin reflujo diseñado para matrices de gran superficie con una deformación de 200 micras o más. Ofrece una conductividad térmica de 16 W/mK a solo 20 psi,lo que lo hace ideal para cabezales de prueba con fuerzas de sujeción de 30 psi o menos. Disponible en espesores de 300 micras a 1 mm, se puede personalizar con o sin barrera de difusión para evitar manchas en el troquel.
- Solder Thermal Interface Materials deliver superior heat dissipation and high thermal conductance for power-dense devices exceeding 1,000 watts. Optimized for BGA package applications, they enable low-void, high-reliability performance across multiple reflow cycles, ensuring thermal stability. Unlike fluidic solutions, they ensure reliable end-of-life performance, preventing failures common with greases. Ideal for portable electronics, they enhance battery life, reduce cooling fan size, and minimize heat-sink mass while maintaining RoHS compliance and supporting steps.
- NC-809 is Indium Corporation’s first no-clean, ultra-low residue, ball-attach flux on the market. It is a dual-purpose flux, engineered with high-tack characteristics for flip-chip applications with strong wetting power for ball-attach applications.
- SiPaste® series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance.Indium Corporation’s SiPaste® C312HF is a new formulation offering the same excellent printing performance and material stability over time, with the benefit of having an easily cleanable chemistry with semi-aqueous or saponifier technology.
To learn more about Indium Corporation’s solutions for advanced power electronics, visit indiumstg.wpenginepowered.com or meet our experts at SEMICON Southeast Asia at booth #L2127.
Acerca de Indium Corporation
IndiumCorporation® es una empresa líder en el refinado, fundición, fabricación y suministro de materiales para los mercados mundiales de electrónica, semiconductores, películas finas y gestión térmica. Entre sus productos se incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; blancos de pulverización; indio, galio, germanio y estaño metálicos y compuestos inorgánicos; yNanoFoil®. Fundada en 1934, la empresa cuenta con asistencia técnica global y fábricas ubicadas en China, Alemania, India, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
