관련 기사
Indium Corporation Presents Collaborative Research on Solder Alloy Reliability for Heterogeneous Integration at ICEP-HBS
CLINTON, N.Y., April 14, 2026 — Indium Corporation® Senior Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim will present a collaborative International Electronics
Double Win: Indium Corporation’s CW-807RS and Indium12.9HF Receive EM Asia Innovation Honors
CLINTON, N.Y., April 6, 2026 — Indium Corporation®, a leading materials provider for the electronics assembly market, recently received Electronics Manufacturing (EM) Asia Innovation Awards for
Indium Corporation Announces Strategic Agreement for Domestic Critical Metals Recovery
CLINTON, N.Y., April 3, 2026 — Indium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and electronics assembly, announced that it has executed a