Indium Corporations Milo Lazi, product development specialist, will share his industry knowledge on metal thermal interface materials (TIMs) in high-performance applications at SEMI-THERM, March 21-25, San Jose, Calif., U.S.
Because of their high bulk thermal conductivity, metal TIMs have been explored and used in niche applications for many years. As we continue to see the advancement of high-performance integrated circuit packages, managing heat dissipation continues to be a critical part of the design. As polymeric TIMs are reaching physical limits relative to thermal conductivity, there is a need for higher performing materials. Metal TIMs will play a critical role in addressing this need.
In this presentation, Lazi will discuss the needs of several package styles as well as some specialized systems. Through the discussion of their heat dissipation challenges, he will provide data on how specially-designed metal TIMs could be part of that solution. Because there are widely divergent needs for TIMs, five categories of metal TIMs technology are available to address sub-sets of these needs. A detailed review of these material categories, performance attributes, and key assembly parameters will be discussed, enabling the attendee to make intelligent decisions on when to consider metal TIMs and which category of metal TIM might be the most appropriate for a given application.
Lazi will also give a vendor presentation on The Power of m2TIMs. Solid liquid hybrid (SLH) TIMs are a combination of metals that are solid at room temperature with those that are liquid at room temperature. These materials are separated into two categories: m2TIMs (liquid metal with solid metal preforms) and hybrid liquid pastes. In this presentation, Lazi will show that adding solid metal to liquid metal can improve the properties of TIMs. That type of leakage-free TIM (none of the material will pump out) will be less prone to oxidation and will be able to survive a larger number of thermal cycles. Overall, thermal conductivity will be higher due to the higher conductivity of solid metals. Lazi will show how different types of solid metals in m2TIMssolder preforms, compressible TIMs, and reinforced matrixed solder composites (preforms with a copper matrix)can be used in different TIM applications. He will show which type of m2TIMs are recommended for different types of TIMs: TIM1, TIM2, and TIM1.5 (or TIM0). Finally, he will show which kind of automated process for high-volume production is best suited for each of these m2TIMs.
For more information about Indium Corporations technical knowledge, thermal solutions, and experts, visit booth #500 at the show.
Lazi provides technical support, including guidance and recommendations to customers related to process steps, equipment, techniques, and materials. In addition, he delivers technical training to staff and industry partners. Lazi attended the University of Nis, School of Electronic Engineering, where he earned his bachelors degree in electrical engineering and masters degree (M. Eng.) in electronic engineering. Lazi is a founder of the non-profit organization Urban Youth Forum, which encourages students to plan, develop, and execute projects involving environmental protection through the recycling of electronic waste.
인디엄 코퍼레이션 소개
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재 정제, 제련, 제조 및 공급업체입니다. 제품에는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil 이 포함됩니다. 1934년에 설립된 이 회사는 중국, 독일, 인도, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인디움 코퍼레이션에 대한 자세한 정보는 www.indium.com 또는 징야 황에게 이메일을 보내주세요. 또한 From One Engineer To Another (#FOETA)의 전문가를 www.linkedin.com/company/indium-corporation/ 또는 @IndiumCorp에서 팔로우할 수도 있습니다.
About SEMI-THERM
SEMI-THERM is an international forum dedicated to the thermal management and characterization of electronic components and systems. It provides knowledge covering all thermal length scales from IC to facility level. The symposium fosters the exchange of knowledge between thermal engineers, professionals, and leading experts from the industry as well as the exchange of information on the latest academic and industrial advances in electronics thermal management.
