Indium Corporation experts Andreas Karch, Regional Technical Manager, Germany, Austria, and Switzerland, and Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will share their industry knowledge during SMTconnect 2019 from May 7-9 in Nuremberg, Germany.
Vijay will present Automotive PCBA & No-Clean Solder Paste—Enhanced Electrical Reliability for High-Power Components. As automotive electrification and subsequent use of high-power components in under-the-hood electronics increases—as in 48V, HEV, and EV technologies—surface insulation resistance (SIR) specifications to assess the electrical reliability of the no-clean solder paste flux chemistry have become more stringent. Vijay willdiscuss the influence of no-clean flux chemistries on dendritic growth for high-power, low-standoff components as it pertains to these enhanced SIR conditions.
Karch will discuss Future-Proof Flux Systems in Solder Pastes: The Requirements for Electrical Reliability Are Increasing. Due to changes in the operating conditions of electronics assemblies, there are always new mission profiles for lifetime reliability. This also increases the demands on the materials used. In the area of "no-clean" solder pastes, the focus is on the SIR (surface insulation resistance) test as proof of the electrochemical duration reliability of these flux residues. For example, today's existing test duration has increased from 168 hours to 1,000 hours (+600%). Modern flux systems in solder pastes already have answers to these new challenges.
Vijay is based in the UK and manages Indium Corporation’s technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Vijay is active in several industry organizations, including IMAPS and the Surface Mount Technology Association (SMTA), and has presented at industry forums and conferences internationally. He earned his master’s degree in Systems Science and Industrial Engineering from Binghamton University, State University of New York.
As the Regional Technical Manager for Germany, Austria, and Switzerland, Karch provides support to Indium Corporation’s customers in those regions, including sharing process knowledge and making product recommendations. He has more than 20 years of automotive industry experience, including the advanced development of customized electronics. Karch is an ECQA-certified integrated design engineer, has a Six Sigma Yellow Belt, and was selected by the Austrian Patent Office as one of the 2014 recipients of the Top 10 Inventum Awards for an automotive LED assembly.
Indium Corporation will feature the solder products for high-reliability applications at the show, including Indium8.9HF solder paste, which exceeds all requirements for higher electronical reliability and has been approved for use in numerous automotive applications. To enable your process for 48V, please talk with our experts and find out more for your processes. For more information about Indium Corporation’s experts’ recent work, visit indiumstg.wpenginepowered.com/techlibrary or find them at the show in hall 5, booth 310.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
