Indium Corporation will feature its precision gold alloy solder preforms at the SPIE Defense + Commercial Sensing Expo, April 15-19, in Orlando, Fla.
Depending on the alloy, gold-based solders have a melting point ranging from 280-1,064°C, making it compatible with subsequent reflow processes. In addition, gold-based solders are resistant to corrosion, provide superior thermal fatigue resistance, and exhibit excellent joint strength.
Indium Corporation's AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing. AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical.
Semiconductor-grade AuSn preforms are designed specially to meet the challenges facing RF and power semiconductor devices as they continue to get smaller, with increasing power density and power ratings.
Indium Corporation's Pb-free and RoHS-compliant preforms are available in a variety of standard and custom-engineered designs. For more information about Indium Corporation's gold alloy solder preforms, visit us at booth 1714 or go to www.indium.com/gold.
인디엄 코퍼레이션에 대한 자세한 정보는 www.indium.com 또는 이메일 ([email protected])로 문의하세요 . 또한 From One Engineer To Another® (#FOETA)의 전문가를 www.facebook.com/indium 또는 @IndiumCorp에서 팔로우할 수도 있습니다.
