Indium Corporation will feature Heat-Spring®, a compressible, recyclable, metal thermal interface material, at the IMAPS 48th annual International Symposium on Microelectronics, Oct. 26-29, in Orlando, Fla.
The use of high-power LEDs is growing exponentially due to light quality, energy efficiency, and reliability. These attributes are directly related to design and assembly methods and materials.
Indium Corporation’s Heat-Spring is a compressible interface material that provides 86 W/mK of thermal conductivity using a pressure range of only 35 to 100+ psi. Heat-Spring is suitable for pick-and-place equipment, and offers superior conductivity and ease of use, as compared to thermal grease alternatives. In addition, Heat-Spring will not bake out or pump out, optimizing long-term performance consistency and eliminating the rework process.
Heat-Spring is reclaimable and recyclable, and is packaged in custom trays or tape & reel.
For more information on Heat-Spring, visit indiumstg.wpenginepowered.com/thermal-interface-materials/heat-spring.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는 indiumstg.wpenginepowered.com을 방문하거나 [email protected]으로 이메일을 보내 주시기 바랍니다. 또한 www.facebook.com/indium 또는 @IndiumCorp에서 당사의 전문가 그룹인 ‘From One Engineer ToAnother® (#FOETA)’를 팔로우하실 수 있습니다.
