Indium Corporation will feature its reinforced indium and solder alloy fabrications, InFORMS®, at PCIM Europe, May 19-21 in Nuremberg, Germany.
InFORMS are patented fabrications in which braided, woven, or random-fiber metal substrate materials are embedded into a solder preform. This technology is ideally suited for IGBT assembly of the DBC to the baseplate.
InFORMS create solder joints with a precisely controlled final solder joint thickness. The embedded metal does not melt during the reflow process and maintains a precise bondline thickness in the final solder joint. InFORMS maintain the highest thermal and electrical conductivity as compared to typical soldered interconnections, and, by controlling the bondline thickness, the thermal performance is also more repeatable from device-to-device.
InFORMS provide engineers with an enhanced material for the development of new, or the improvement of existing, applications. For more information about InFORMS, visit indiumstg.wpenginepowered.com/thermal-interface-materials or visit Indium Corporation at stand 7-441.
인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는 indiumstg.wpenginepowered.com을 방문하거나 [email protected]으로 이메일을 보내 주시기 바랍니다. 또한 www.facebook.com/indium 또는 @IndiumCorp에서 당사의 전문가 그룹인 ‘From One Engineer ToAnother® (#FOETA)’를 팔로우하실 수 있습니다.
