Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at APEC 2018, March 4-8, in San Antonio, Texas.
Indium Corporation is redefining solder with its InFORMS preforms and patent-pending solder ribbon for automated assembly.
According to Seth Homer, Product Manager, InFORMS are a composite fabrication consisting of solder and a reinforcing matrix that stabilizes bondline thickness. “Using an InFORM between the baseplate and substrate will ensure bondline planarity, giving your assembly a much more stable joint and increasing the reliability of your end product.”
InFORMS are invaluable in the production process because they provide:
- A drop-in replacement for other bondline control methods
- Increased lateral strength
- Bondline co-planarity
- Improved thermal cycling reliability
InFORMS are available in a variety of alloys, including SAC and SnPb alloys.
For more information about InFORMS, visit indiumstg.wpenginepowered.com/inform.
인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는indiumstg.wpenginepowered.com을방문하거나[email protected]으로 이메일을 보내 주시기 바랍니다. 또한www.facebook.com/indium또는@IndiumCorp에서 당사의 전문가 그룹인 From One Engineer ToAnother®(#FOETA)를 팔로우하실 수 있습니다.
