Indium Corporation is offering a free presentation for students and young professionals to expand their industry knowledge of reflow basics during the virtual exposition at SMTA International from Sept. 28-30.
Kim Flanagan, Technical Support Engineer II, will present Reflow 101 from a Solder Manufacturer's Perspective as part of SMTA's Jump Start program. Understanding the reflow process in a soldering application is critical to producing high-quality solder joints. There are many characteristics to be considered when optimizing the solder reflow process in SMT assembly applications. In this presentation, Flanagan will start with the basics of the reflow process, how the solder paste behaves during reflow, and general reflow profiling best practices. She will then discuss some common solder defects and how to troubleshoot and remedy them from a reflow perspective.
The Jump Start Program: Industry Basics to Grow in Your Career will be available to stream in the virtual SMTA booth.
Flanagan provides technical support and guidance on process steps, equipment, techniques, and materials to customers. In addition, she provides technical training to staff and industry partners. Flanagan began her career with Indium Corporation through the company's summer college internship program, working in the Quality Department. She remained with Indium Corporation as a part-time Quality Engineering Technician while she finished her bachelor's degree in physics at Le Moyne College in Syracuse. She joined the technical support team in January 2017.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재 정제, 제련, 제조 및 공급업체입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 중국, 인도, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
