Several Indium Corporation technology experts will lead technical sessions at the Surface Mount Technology Association’s International Conference and Exhibition (SMTAi) from Sept. 28-Oct. 2 in Rosemont, Ill.
Tim Jensen, senior product manager for engineered solders, will co-chair session MFX7: Lead-Free Alloys End Use-Application Reliability, which will review the formation of intermetallic compounds, as well as their impact on reliability, when using lead-free solder alloys.
Glen Thomas, product manager for PCB assembly solder paste, will serve as session chair for SMT3: PCB Component/Connector Rework-From Small to Large. This session will include a summary of recommended methods used to rework large and small PCB components and connectors for effective time and cost management.
Eric Bastow, assistant technical manager, will serve as session chair for AAT7: Fluxes, Standards and Contaminants Face Off with Reliability. This session will discuss the effects of contamination, as well as a variety of stressing environments and tests, on various fluxes. The session will finish with a summary and clarification of new aspects of IPC J-STD-004.
SMTA International is an annual technical conference and exhibition on electronics assembly and advanced packaging that draws industry professionals from around the world. For a full schedule of sessions, visit www.smta.org/smtai.
Jensen is an SMTA-certified process engineer. He earned his bachelor’s degree in chemical engineering from Clarkson University. He has spent more than 15 years working with customers troubleshooting and optimizing SMT process lines, and solving issues such as head-in-pillow, graping, and QFN voiding. Jensen is responsible for Indium Corporation’s most diverse product group, which includes solder preforms, wire, ribbon, and foil, as well as thermal interface materials.
Thomas has more than 25 years of experience working with printed wiring boards and semiconductor packaging. He earned his bachelor’s degree in chemical engineering from the University of Wisconsin and his master’s degree, also in chemical engineering, from Michigan State University.
Bastow provides technical support for Indium Corporation’s full range of solder products for electronics assembly, semiconductor package assembly, and thermal management. He earned his associate’s degree in engineering science from the State University of New York in Herkimer and earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College. Bastow is a certified IPC-A-600 and 610D specialist and SMTA-certified process engineer.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
