As one of the industry’s foremost providers of Au-based products, Indium Corporation will proudly feature its high-temperature and high-reliability gold solder solutions at the International Conference and Exhibition on High Temperature Electronics (HiTEC), hosted by IMAPS, in Albuquerque, New Mexico, April 18-20. Among its featured Au-based products, Indium Corporation will showcase its AuLTRA ThInFORMS0.00035″ thick (0.00889mm or 8.89m) 80Au/20Sn preforms.
As a leading gold solder innovator, Indium Corporation’s gold-based portfolio includes wire, paste, preforms, spheres, shot, and ribbon manufactured with cutting-edge technology to ensure supreme quality and the utmost precision. The most commonly used gold-based alloy is 80Au/20Sn; it is the pillar alloy of the microelectronics industry with a melting point of 280C and works exceptionally well in the majority of die-attach and lid sealing applications. It exhibits good thermal fatigue properties and is used in many applications that require high tensile strength and high corrosive resistance. Indium Corporation’s AuSn solder offers numerous benefits including:
- 솔더 중 가장 높은 인장 강도
- 후속 리플로우 공정과 호환되는 높은 융점
- 뛰어난 열 전도성
- 부식에 대한 내성
An excellent choice for die-attach applications, AuLTRA ThInFORMS improve the overall operational efficiency of high-output lasers. They help combat issues such as:
- 솔더 부피 감소로 다이의 위킹을 억제하여 단락 위험 최소화
- Poor thermal transferthe ultra-thin 0.00035″ preform reduces bondline thickness (BLT), thus improving thermal transfer and increasing the longevity and performance of the device
To learn more about Indium Corporation’s Au-based solutions, visit https://www.indium.com/products/solders/gold/ or stop by our booth at HiTEC.
인디엄 코퍼레이션 소개
Indium Corporation 은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재 정제, 제련, 제조 및 공급업체입니다. 제품에는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil 이 포함됩니다. 1934년에 설립된 이 회사는 중국, 독일, 인도, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인디움 코퍼레이션에 대한 자세한 정보는 www.indium.com 또는 징야 황에게 이메일을 보내주세요. 또한 From One Engineer To Another (#FOETA)의 전문가를 www.linkedin.com/company/indium-corporation/ 또는 @IndiumCorp에서 팔로우할 수도 있습니다.
About IMAPS
The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through premier professional events, an exclusive microelectronics packaging research library, local chapter networks, and other efforts. Founded in 1967 as ISHM, then merging with the International Electronic and Packaging Society (IEPS) in 1996, the Society has over 50 years of networking, education, and publication history.
