Indium Corporation will feature its MEMS microphone lid-attach Indium8.9HF Solder Paste at MEPTEC’s 15th Annual MEMS and Sensors Technology Symposium on June 6, in San Jose, Calif.
Indium8.9HF is a no-clean, halogen-free (no intentionally added, halogen-free flux) solder paste that enables dispensing of fine lines and shapes down to a width of less than 150 microns. Indium8.9HF provides reliable and consistent dispensing of a standard racetrack deposit using automated time/pressure or auger-based dispensing equipment.
Indium8.9HF eliminates failure modes, such as blow-hole, reduces solder creep, and increases solder joint shear strength. The flux is suitable for use with all standard Pb-free higher-melting alloys, such as those based on SnSb and SnAg.
For more information about Indium Corporation’s Indium8.9HF solder paste, visit indiumstg.wpenginepowered.com/indium8.9hf.
인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는indiumstg.wpenginepowered.com을방문하거나[email protected]으로 이메일을 보내 주시기 바랍니다. 또한www.facebook.com/indium또는@IndiumCorp에서 당사의 전문가 그룹인 From One Engineer ToAnother®(#FOETA)를 팔로우하실 수 있습니다.
